价 格: | 面议 | |
应用范围: | 补偿 | |
种类: | 电感磁珠 | |
品牌/商标: | ABC/千如 | |
型号/规格: | SS1205-L-□□□ | |
封装形式: | 贴片电感 | |
绕线形式: | 多层平绕式 | |
导磁体性质: | 磁芯 | |
磁芯形状: | 长方形 | |
工作频率: | 低频 | |
安装方式: | 贴片式 | |
骨架材料: | 塑料 | |
品质因数Q: | - | |
电感量: | -(mH) | |
额定电流: | -(mA) | |
分布电容: | -(F) |
SMD Power InductorSS1205-L-□□□Series |
◆Configuration & Dimension:dzsc/18/9797/18979700.jpgPrint |
dzsc/18/9797/18979700.jpg |
◆Schematic diagram: |
dzsc/18/9797/18979700.jpg |
◆Materials : |
a. Core : Ferrite DR core |
b. Core : Ferrite RI core |
c. Wire : Enamelled copper wire ( class F ) |
d. Base : LCP E4008 |
e. Adhesive : Epoxy resin |
f. Terminal : Cu / Ni / Sn |
g. Remark : Products comply with RoHS' requirements |
◆General Specification : |
a. Temp. rise : 40°C max. |
b. Rated current : Base on Temp. rise & △L/L0A = 10% max. |
c. Storage temp. : -40°C -- 125°C |
d. Operating temp. : -40°C-- 105°C |
e. Resistance to solder heat : 260°C.10secs. |
dzsc/18/9797/18979700.jpg |
◆Electrical Characteristics: |
dzsc/18/9797/18979700.jpg |
◆Packing Information : |
dzsc/18/9797/18979700.jpg |
◆DWGING NUMBER EXPRESSION: |
dzsc/18/9797/18979700.jpg |
◆Reliability Test: |
dzsc/18/9797/18979700.jpg |
◆UL Card: |
dzsc/18/9797/18979700.jpg |
dzsc/18/9797/18979700.jpg |
SMD Power InductorSB7045-L-□□□Series ◆Configuration & Dimension:dzsc/19/0203/19020322.jpgPrintdzsc/19/0203/19020322.jpg ◆Schematic diagram:dzsc/19/0203/19020322.jpg ◆Materials : a. Core : Ferrite DR core b. Wire : Enamelled copper wire ( class F ) c. Terminal : Cu / Ni / Sn d. Base : LCP Base e. Adhesive : Epoxy resin f. Remark : Products comply with RoHS" requirements ◆General Specification : a. Temp. rise : 40°C max. b. Storage temp. : -40°C -- 125°C c. Operating temp. : -40°C-- 125°C ( Temp. rise included ) d. Resistance to solder heat : 260°C.10secs. dzsc/19/0203/19020322.jpg ◆Electrical Characteristics:dzsc/19/0203/19020322.jpg ◆Packing Information :dzsc/19/0203/19020322.jpg ◆DWGING NUMBER EXPRESSION:dzsc/19/0203/19020322.jpg ◆Reliability Test:dzsc/19/0203/19020322.jpg ◆UL Card:dzsc/19/0203/19020322.jpg dzsc/19/0203/19020322.jpg
Multilayer Chip InductorMH1608-L-□□□Series ◆Configuration & Dimension:dzsc/19/0203/19020323.jpgPrintdzsc/19/0203/19020323.jpg ◆Schematic diagram:dzsc/19/0203/19020323.jpg ◆Features :a. Monolithic structure ensuring high performance and reliability b. High frequency applicatons up to 6 GHz. c. Terminal : Ag / Cu / Ni / Sn d. Remark : Products comply with RoHS" requirements ◆Applications:a. RF modules for telecommunication systems including GSM, PCS, DECT, WLAN, Bluetooth,etc. ◆General Specification : a. Storage temp. : -55°C-- 125°C b. Operating temp. : -55°C-- 125°C c. Solderability : Preheat 150°C±25°C for 60 secs.dzsc/19/0203/19020323.jpgSolder : Sn96.5 / Ag3 / Cu0.5 or equivalentdzsc/19/0203/19020323.jpgSolder temp. : 260 ± 5°Cdzsc/19/0203/19020323.jpgFlux : Rosindzsc/19/0203/19020323.jpgDip time : 4±1 secs. dzsc/19/0203/19020323.jpg ◆Electrical Characteristics:dzsc/19/0203/19020323.jpg ◆Packing Inf...