| 价 格: | 面议 | |
| 应用范围: | 补偿 | |
| 种类: | 电感磁珠 | |
| 品牌/商标: | ABC/千如 | |
| 型号/规格: | SB7045-L-□□□ | |
| 封装形式: | 贴片电感 | |
| 绕线形式: | 多层平绕式 | |
| 导磁体性质: | 磁芯 | |
| 磁芯形状: | 长方形 | |
| 工作频率: | 低频 | |
| 安装方式: | 贴片式 | |
| 骨架材料: | 塑料 | |
| 品质因数Q: | - | |
| 电感量: | -(mH) | |
| 额定电流: | -(mA) | |
| 分布电容: | -(F) |
| SMD Power InductorSB7045-L-□□□Series |
| ◆Configuration & Dimension:dzsc/19/0203/19020322.jpgPrint |
| dzsc/19/0203/19020322.jpg |
| ◆Schematic diagram: |
| dzsc/19/0203/19020322.jpg |
| ◆Materials : |
| a. Core : Ferrite DR core |
b. Wire : Enamelled copper wire ( class F ) |
| c. Terminal : Cu / Ni / Sn |
| d. Base : LCP Base |
| e. Adhesive : Epoxy resin |
| f. Remark : Products comply with RoHS" requirements |
| ◆General Specification : |
| a. Temp. rise : 40°C max. |
| b. Storage temp. : -40°C -- 125°C |
| c. Operating temp. : -40°C-- 125°C ( Temp. rise included ) |
| d. Resistance to solder heat : 260°C.10secs. |
| dzsc/19/0203/19020322.jpg |
| ◆Electrical Characteristics: |
| dzsc/19/0203/19020322.jpg |
| ◆Packing Information : |
| dzsc/19/0203/19020322.jpg |
| ◆DWGING NUMBER EXPRESSION: |
| dzsc/19/0203/19020322.jpg |
| ◆Reliability Test: |
| dzsc/19/0203/19020322.jpg |
| ◆UL Card: |
| dzsc/19/0203/19020322.jpg |
| dzsc/19/0203/19020322.jpg |
Multilayer Chip InductorMH1608-L-□□□Series ◆Configuration & Dimension:dzsc/19/0203/19020323.jpgPrintdzsc/19/0203/19020323.jpg ◆Schematic diagram:dzsc/19/0203/19020323.jpg ◆Features :a. Monolithic structure ensuring high performance and reliability b. High frequency applicatons up to 6 GHz. c. Terminal : Ag / Cu / Ni / Sn d. Remark : Products comply with RoHS" requirements ◆Applications:a. RF modules for telecommunication systems including GSM, PCS, DECT, WLAN, Bluetooth,etc. ◆General Specification : a. Storage temp. : -55°C-- 125°C b. Operating temp. : -55°C-- 125°C c. Solderability : Preheat 150°C±25°C for 60 secs.dzsc/19/0203/19020323.jpgSolder : Sn96.5 / Ag3 / Cu0.5 or equivalentdzsc/19/0203/19020323.jpgSolder temp. : 260 ± 5°Cdzsc/19/0203/19020323.jpgFlux : Rosindzsc/19/0203/19020323.jpgDip time : 4±1 secs. dzsc/19/0203/19020323.jpg ◆Electrical Characteristics:dzsc/19/0203/19020323.jpg ◆Packing Inf...
Wound Chip InductorCM4532-L-□□□Series ◆Configuration & Dimension:dzsc/19/0205/19020521.jpgPrintdzsc/19/0205/19020521.jpg ◆Schematic diagram:dzsc/19/0205/19020521.jpg ◆Materials : a. Core : Ferrite DR core b. Wire : Enamelled copper wire ( class H ) c. Terminal : Cu / Sn d. Encapsulate : Epoxy novolac molding compound e. Remark : Products comply with RoHS" requirements ◆General Specification : a. Temp. rise : 20°C max. b. Ambient temp. : 100°C max. c. Storage temp. : -40°C-- 125°C d. Operating temp. : -40°C-- 125°Ce. Terminal strength : 0.5kg min.f. Rated current : Current cause inductance drop within 10%g. Resistance to solder heat : 260°C.10secs.h. Resistance to solvent : Per MIL-STD-202F dzsc/19/0205/19020521.jpg ◆Electrical Characteristics:dzsc/19/0205/19020521.jpg