价 格: | 面议 | |
应用范围: | 补偿 | |
种类: | 电感磁珠 | |
品牌/商标: | ABC/千如 | |
型号/规格: | MH1608-L-□□□ | |
封装形式: | 贴片电感 | |
绕线形式: | 多层平绕式 | |
导磁体性质: | 磁芯 | |
磁芯形状: | 长方形 | |
工作频率: | 低频 | |
安装方式: | 贴片式 | |
骨架材料: | 塑料 | |
品质因数Q: | - | |
电感量: | -(mH) | |
额定电流: | -(mA) | |
分布电容: | -(F) |
Multilayer Chip InductorMH1608-L-□□□Series |
◆Configuration & Dimension:dzsc/19/0203/19020323.jpgPrint |
dzsc/19/0203/19020323.jpg |
◆Schematic diagram: |
dzsc/19/0203/19020323.jpg |
◆Features : |
a. Monolithic structure ensuring high performance and reliability |
b. High frequency applicatons up to 6 GHz. |
c. Terminal : Ag / Cu / Ni / Sn |
d. Remark : Products comply with RoHS" requirements |
◆Applications: |
a. RF modules for telecommunication systems including GSM, PCS, DECT, WLAN, Bluetooth,etc. |
◆General Specification : |
a. Storage temp. : -55°C-- 125°C |
b. Operating temp. : -55°C-- 125°C |
c. Solderability : Preheat 150°C±25°C for 60 secs. |
dzsc/19/0203/19020323.jpgSolder : Sn96.5 / Ag3 / Cu0.5 or equivalent |
dzsc/19/0203/19020323.jpgSolder temp. : 260 ± 5°C |
dzsc/19/0203/19020323.jpgFlux : Rosin |
dzsc/19/0203/19020323.jpgDip time : 4±1 secs. |
dzsc/19/0203/19020323.jpg |
◆Electrical Characteristics: |
dzsc/19/0203/19020323.jpg |
◆Packing Information : |
dzsc/19/0203/19020323.jpg |
◆DWGING NUMBER EXPRESSION: |
dzsc/19/0203/19020323.jpg |
Wound Chip InductorCM4532-L-□□□Series ◆Configuration & Dimension:dzsc/19/0205/19020521.jpgPrintdzsc/19/0205/19020521.jpg ◆Schematic diagram:dzsc/19/0205/19020521.jpg ◆Materials : a. Core : Ferrite DR core b. Wire : Enamelled copper wire ( class H ) c. Terminal : Cu / Sn d. Encapsulate : Epoxy novolac molding compound e. Remark : Products comply with RoHS" requirements ◆General Specification : a. Temp. rise : 20°C max. b. Ambient temp. : 100°C max. c. Storage temp. : -40°C-- 125°C d. Operating temp. : -40°C-- 125°Ce. Terminal strength : 0.5kg min.f. Rated current : Current cause inductance drop within 10%g. Resistance to solder heat : 260°C.10secs.h. Resistance to solvent : Per MIL-STD-202F dzsc/19/0205/19020521.jpg ◆Electrical Characteristics:dzsc/19/0205/19020521.jpg
SMD Power InductorSS0906-L-□□□Series ◆Configuration & Dimension:dzsc/19/0228/19022830.jpgPrintdzsc/19/0228/19022830.jpg ◆Schematic diagram:dzsc/19/0228/19022830.jpg ◆Materials : a. Core : Ferrite DR core b. Core : Ferrite RI core c. Wire : Enamelled copper wire ( class F ) d. Base : LCP e. Adhesive : Epoxy resin f. Terminal : Cu / Ni / Sn g. Remark : Products comply with RoHS' requirements ◆General Specification : a. Temp. rise : 40°C max. b. Rated current : Base on Temp. rise & △L/L0A = 10% max. c. Storage temp. : -40°C -- 125°C d. Operating temp. : -40°C-- 105°C e. Resistance to solder heat : 260°C.10secs. dzsc/19/0228/19022830.jpg ◆Electrical Characteristics:dzsc/19/0228/19022830.jpg ◆Packing Information :dzsc/19/0228/19022830.jpg ◆DWGING NUMBER EXPRESSION:dzsc/19/0228/19022830.jpg ◆Reliability Test:dzsc/19/0228/19022830.jpg ◆UL Card:dzsc/19/0228/19022830.jpg