全自动上下片-Load/Unload capability for Wafer Ring Cette
双主轴-Dual-head Spindle
自动清洗功能-Built-in Auto-washing station
可加工12英寸晶片或310mm工件-Cater up to 12"chuck table or 310mm work piece
水量监控-Detection sensor for incoming water
CS-Contact blade setup or VBS-Vertical non-contact blade setup
PRS识别系统-PRS-Pattern Recognition System
多通道-Multi Pattern Recognition
间距自动检查-Auto Pitch Check
刀具寿命监测-Blade Lifespan Monitoring System
切割方向-Cut direction setup（Up/down cut）
Hairline＆Saw street adjustment capability
Multi-Channel Programming
刀破检测-BBD-Blade Breakage Detector
双主轴-Dual-head Spindle
自动清洗功能-Built-in Auto-washing station
可加工12英寸晶片或310mm工件-Cater up to 12"chuck table or 310mm work piece
水量监控-Detection sensor for incoming water
CS-Contact blade setup or VBS-Vertical non-contact blade setup
PRS识别系统-PRS-Pattern Recognition System
多通道-Multi Pattern Recognition
间距自动检查-Auto Pitch Check
刀具寿命监测-Blade Lifespan Monitoring System
切割方向-Cut direction setup（Up/down cut）
Hairline＆Saw street adjustment capability
Multi-Channel Programming
刀破检测-BBD-Blade Breakage Detector
