乾野电子主营范围:超结MOSFET,中低压MOSFET,高压MOSFET,51单片机系列。
MOSFET的参数介绍
Parameter |
Symbol |
Limit |
Unit |
Drain-Source Voltage |
VDS |
-55 |
V |
Gate-Source Voltage |
VGS |
±20 |
V |
Drain Current-Continuous |
ID |
-30 |
A |
Drain Current-Continuous(TC=100℃) |
ID (100℃) |
-21 |
A |
Pulsed Drain Current |
IDM |
110 |
A |
Maximum Power Dissipation |
PD |
90 |
W |
Derating factor |
|
0.72 |
W/℃ |
Single pulse avalanche energy (Note 5) |
EAS |
420 |
mJ |
Parameter |
Symbol |
Condition |
Min |
Typ |
Max |
Unit |
Off Characteristics |
||||||
Drain-Source Breakdown Voltage |
BVDSS |
VGS=0V ID=-250μA |
-55 |
- |
- |
V |
Zero Gate Voltage Drain Current |
IDSS |
VDS=-55V,VGS=0V |
- |
- |
1 |
μA |
Gate-Body Leakage Current |
IGSS |
VGS=±20V,VDS=0V |
- |
- |
±100 |
nA |
On Characteristics (Note 3) |
||||||
Gate Threshold Voltage |
VGS(th) |
VDS=VGS,ID=-250μA |
-2 |
-3 |
-4 |
V |
Drain-Source On-State Resistance |
RDS(ON) |
VGS=-10V, ID=-15A |
- |
30 |
40 |
mΩ |
Forward Transconductance |
gFS |
VDS=-25V,ID=-16A |
8 |
- |
- |
S |
Dynamic Characteristics (Note4) |
当MOSFET的尺寸缩的非常小、栅极氧化层也变得非常薄时,例如现在的制程可以把氧化层缩到一纳米左右的厚度,一种过去没有发现的现象也随之产生,这种现象称为"多晶硅耗尽".当MOSFET的反转层形成时,有多晶硅耗尽现象的MOSFET栅极多晶硅靠近氧化层处,会出现一个耗尽层(depletion layer),影响MOSFET导通的特性。要解决这种问题,金属栅极是的方案。目前可行的材料包括钽(Tantalum)、钨、氮化钽(Tantalum Nitride),或是氮化钛(Titalium Nitride)。这些金属栅极通常和高介电常数物质形成的氧化层一起构成MOS电容。另外一种解决方案是将多晶硅完全的合金化,称为FUSI(FUlly-SIlicide polysilicon gate)制程。
乾野电子主营范围:超结MOSFET,中低压MOSFET,高压MOSFET,51单片机系列。 MOSFET的参数介绍 Parameter Symbol Limit Unit Drain-Source Voltage VDS -55 V Gate-Source Voltage VGS ±20 V Drain Current-Continuous ID -30 A Drain Current-Continuous(TC=100℃) ID (100℃) -21 A Pulsed Drain Current IDM ...
乾野电子主营范围:超结MOSFET,中低压MOSFET,高压MOSFET,51单片机系列。 MOSFET的参数介绍 Parameter Symbol Limit Unit Drain-Source Voltage VDS -55 V Gate-Source Voltage VGS ±20 V Drain Current-Continuous ID -30 A Drain Current-Continuous(TC=100℃) ID (100℃) -21 A Pulsed Drain Current IDM ...