价 格: | 0.50 | |
是否提供加工定制: | 是 | |
品牌: | 展旗 | |
型号: | IPOD 30P公座斜15度 | |
应用范围: | 手机 | |
种类: | 插头/插座 | |
接口类型: | IPOD | |
支持卡数: | 单卡 | |
读卡类型: | 30P公母座 | |
形状: | 条形 | |
制作工艺: | 注塑 | |
特性: | 阻火/阻燃 | |
工作频率: | 低频 | |
接触件材质: | 铜合金,镀金,镀锡 | |
绝缘体材质: | UL-94V0,耐高温塑胶料 | |
芯数: | 30 | |
针数: | 30 | |
线长: | 30(mm) |
适用于手机,数码产品做充电,数据传输,提供一公一母对接的工作方式-----目前流行于IPOD手机
0.5pitch SMD焊接方式,定位PIN穿过PCB,更加牢固,更加精准定位
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MINI USB 5PIN,USB接口,USB JACK,USB连接器,5PIN MINI USB接口Notes: 1.Material: Housing: High temperature thermoplastic, UL94V_0,Color, Black. Contact: Copper alloys. Cover: Copper alloys or steel. 2.Plating: Underplate: Nickel. Contact area: Gold over nickel. Solder area: Tin over nickel.3.Electrical characteristics Contact resistance: 50 Milliohms MAX. Insulation resistance: 1,000 Megohms MIN. Dielectric withstanding voltage: 500V AC MIN for 1 MINUTE4.Mechanical characteristics Mating force:3Kgf MAX.Unmating force: 0.3kgf MIN Durability: 5,000 Cycles Prodcut complied with ROHS"
2.0H 全塑型TF卡座,使用于手机,数码产品Notes: 1.Material: Housing: High temperature thermoplastic, UL94V_0,Color, Black. Contact: Copper alloys. 2.Plating: Underplate: Nickel. Contact area: Gold over nickel. Solder area: Tin over nickel.3.Electrical characteristics Contact resistance: 80 Milliohms MAX. Insulation resistance: 1,000 Megohms MIN. Dielectric withstanding voltage: 500V AC MIN for 1 MINUTE4.Mechanical characteristics Retention force:MIN 100gf/PIN Durability: 1,000 Cycles Prodcut complied with ROHS