特征和产品说明:Features and Descriptions:
●标准直径3mm封装 Standard diameter 3mm package
●长寿命和高性 Long life and high reliability
●集成电路 I.C. compatible
●芯片材料:铝镓铟磷 Chip material: AlGaInP?
●低功耗 Low Power
●合ROHS,无铅 RoHS Compliant,no lead
备注:Notes:
●尺寸均为毫米(英寸)。
All dimensions are in millimeters (inches).
● 胶体底部树脂凸出不过1.5mm。
The maximum bulge of resin at the bottom doesn’t exceed 1.5mm .
● 尺寸公差
Tolerance is &plun;0.25