TF CARD CONNEOR, PUSH TYPE
1.0 SCOPE
This specification covers performance, tests, and qiality requirements for SD PUSHCONNEOR TTYPE
2.0 REQUIREMENTS
2.1 Materials And Finish
Insulator:;LCP And PA46,rates UL94V-0
Contacl: （A）Material:Phosphor Bronze,T=0.20mm
(B) Finish:Seleive Gold(lu”/3u”/5u”/10u”/15u”)Plated on Conta Area,Plated Tin/Lead 100u”on solder Area
Card Dete& Write Prote:
(A) Material:Phosphor Bronze,T=0.15mm
(B) Finish:Seleive Gold(lu”/3u”/5u”/10u”/15u”)Plated on Conta Area,Plated Tin/Lead 100u”on solder Area
Shell:SUS304-3/4H,t=0.20mm.
2.2 Charaeristics
Voltage Rating:250V AC
Current Rating:0.5Amps Max
Conta Resistance(signal):40m Ω Initial(100 m Ω After Test)Maximum
Insulatric:Withstanding Voltage: 100 m Ωmaximum.500VDC.
Dieltric: Withstanding Voltage:500VAC/Minute.
Opetating Temperature:-20℃~+60℃
Storage Temperature: -40℃~+70℃.
Mating Cycle:1000 Insertions.
Conta retention in housing:0.3kg/Pin Min.
2.3 Elerical
2.3.1 Rated Current
Requirement:0.5AMP(AC/DC)
Test Condition:Mate conneors measure by dry circuit.
2.3.2 Rated voltage
Requirement:250VAC
Test Condition:Mate conneors measure by dry circuit.
2.3.3 Insulation Resistance
Requirement:1000MΩ Minimum.
Test Condition:Mate cinneors,apply 500V DC between adiacent terminal and ground.
2.3.4 Conta Resistance
Requirement: 40mΩ Minimum.100mΩ Maximum at and off life.
Test Condition:Mate conneors measure by measure by dry circuit.20mm V max,10mA
2.3.5 Dielecric Strength
Requirement:500VAC/Minute
2.4 Mechanical
2.4.1 Insertion Force(max)
Requirement:40N MAX.(4.0kgf)
Test Condition:Insert conneor at the apeed rate of 25&plun;3mm/min.
2.4.2 Extraion Force(min)
Requirement:2N(0.2kgf)
Test Condition:Ratention conneor at the apeed rate of 25&plun;3mm/min.
2.4.3 Conta Retention(min)
Requirement:3N(0.2kgf)
Test Condition:Apply axial pull out force at 25&plun;3mm/min on the embly in the housing.
2.4.4 Durability Cycling(min)
Requirement:10000Cycies
Test Condition:400~600 cycles operations using a mate conneor at therate of 400~600 cycles
Within I hours.
2.5 Solder abililty
2.5.1 Solder ability
Requirement:95%min
Test Condition:①Solder time:3&plun;0.5sec
②Solder temperature:230&plun;5℃
2.5.2 Resistance to Soldering Heat
Requirement: damage
Test Condition:①Immerse test sample into molten solder(260&plun;5℃)to 1.2 mm from
The datum line. The dwell time shell be5&plun;5sec.
②After 30 sec interval. Immerse the sample into solder(260&plun;5℃)for3&plun;5sec.
2.6 Environmental/Reliabillty
2.6.1 Repeated Insertion/Extraion
Requirement:Conta resistance △20mΩ change.
Test Condition:When mated up to 5000cycles reoeatedly by the rate of 400~600cycie.
Per hour.
2.6.2 Temperature Load
Requirement:30℃ Max
Test Condition:Carry rated current load.
2.6.3 Heat Rasistance
equirement:Apperance damage Conta Resistance △20mΩ change.
Test Condition:85&plun;3℃,96hours.
2.6.4 Cold Resistance
Requirement:Apperance danage Conta Resistance △20mΩ change.
Test Condition: -40℃&plun;3℃,96hours.
2.6.5 Temperature:
Requirement:Apperance danage Conta Resistance △20mΩ change.
Test Condition:5cycies 1)-40℃ 30min;2)+85℃ 30 min
2.6.2 Salt Spray
Requirement:Apperance danage Conta Resistance △20mΩ change.
Test Condition:48&plun;4hr exposure to a salt spray from the 5&plun;1% solution at 35&plun;2℃
