■ Feature 特点 特点特点 特点
Compact Size 体积小 体积小 体积小 体积小
Miniaturized SMD packaged in low profile and lightweight.
Low Loss 低插 低插低插 低 入入 入损耗 损耗损耗 损耗
Low insertion loss, high attenuation.
High Soldering Heat Resistance 表面焊接 表面焊接 表面焊接 表面焊接
High quality termination allows both flow and re-flow soldering methods to be applied.
High Performance 特性优良 特性优良 特性优良 特性优良
Eliminate noise over a wide frequency range. Idea for high frequency and space limited
designs.
Available in tape and reel packaging for automatic mounting 卷轴包装适用於 卷轴包装适用於 卷轴包装适用於 卷轴包装适用於表面贴片技术