1、体积更小；Miniature volume. 2、漏磁小，不产生耦合，性高； No cross coupling between inductors due to low magnetic shield and high reliability. 3、无引线，不产生跟踪性，适合高密度表面贴装； No lead, ideal for high density SMT installation, with no directionality. 4、优良的可焊性及耐热冲击性，适合波峰焊及回流焊。 Superior solder ability and resistance to soldering heat, ldeal for wave or reflow soldering.
1、在同样的尺寸下较插装磁珠可产生较高的阻值； Under the same size，the multilayer chip beads produce higher impedance than plug-in beads. 2、与传统的磁珠不同，片式磁珠无引线，只要简单的安装到PCB板上就可抑制EMI和RFI； These chip beads have substantial EMI.RFI suppression by simply mounting them onto PCB. 3、磁珠的形状和尺寸都合EIA标准，可以利用SMT设备进行自动贴装。 No lead, ideal for high density SMT installation, with no directionality. 4、优良的可焊性及耐热冲击性，适合波峰焊及回流焊。 Superior solder ability and resistance to soldering heat, ldeal for wave or reflow soldering.
