双SIM+TF卡卡座_3IN1 三合一
Notes:
1.Material:
Housing: High temperature thermoplastic,
UL94V_0,Color, Black.
Contact: Copper alloys.
Cover: Copper alloys or steel.
2.Plating:
Underplate: Nickel.
Contact area: Gold over nickel.
Solder area: Tin over nickel.
3.Electrical characteristics
Contact resistance: 80 Milliohms MAX.
Insulation resistance: 1,000 Megohms MIN.
Dielectric withstanding voltage: 500V AC MIN for
1 MINUTE
4.Mechanical characteristics
Retention force:MIN100gf/MIN
Durability: 1,000 Cycles
Prodcut complied with ROHS
