◆Viewing angle:120 deg
发光角度：120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm&tim;1.2mm&tim;0.75mm T-LED
外型尺寸
◆Lens Appearance: Water Clear
胶体颜色：水色透明
◆ RoHS compliant lead-free soldering compatible
合ROHS（危害物质禁用指令）要求。
※Absolute maximum ratings at Ta=25℃额定值
Parameter 参数 | Symbol 号 | Value 值 | Unit 单位 |
Power dissipation功率耗损 | Pd | 65 | mW |
Forward current正向电流 | If | 30 | mA |
Reverse voltage反向电压 | Vr | 5 | V |
Operating temperature range工作温度范围 | -40~+85 | ℃ | |
Storage temperature range贮存温度范围 | Tstg | -40~+100 | ℃ |
Peak pulsing current脉冲电流 | Ifp | 100 | mA |
Electrostatic Discharge静电能力 | D | 2000(HBM) | V |
TE: IFP Conditions: Pulse Width≦10msec. and Duty cycle≦1/10.
IFP条件：脉冲持续时间≦10msec，占空因素≦1/10
※ Electrical-optical characteristics at Ta=25℃电性光电特性
Parameter 参数 | Tt Condition 测试条件 | Symbol 号 | Value值 | Unit 单位 | ||
Min. | T. | Max. | ||||
Forward voltage 正向电压 | If=20mA | VF | 2.0 | -- | 2.4 | V |
Lumius intensity 发光强度 | If=20mA | Iv | 150 | -- | 200 | mcd |
Dominant welength 主波长 | If=20mA | WLD | 620 | -- | 630 | nm |
Viewing angle at 50% Iv 半功率角 | If=20mA | 2 θ 1/2 | -- | 120 | -- | Deg |
Reverse current 反向电流 | Vr=5V | Ir | -- | -- | 10 | mA |
TE: 1. Tolerance of lumius intensity is&plun;10%
发光强度公差为&plun;10%
2. Tolerance of forward voltage is&plun;0.05V
正向电压公差&plun;0.05v
信赖性试验
| 试验类别Clification | 试验项目 Tt Item | 试验条件 Tt Condition | 试验设备 Tt Equipment | 样品数 Sample Size | 失败率 Failure Rate |
| 耐久性试验 Endurance Tt | 室温通电试验 Operation Life | Temp=(25&plun;5)℃ RH=(50&plun;10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs | 烧机板 Burn in board | 20 | 0 |
| 高温高湿储存试验 High Temperature High Humidity Storage | Temp=(85&plun;5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 高温高湿反向耐压试验 High Temperature High HumidityReverse Bias | Temp=(85&plun;5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 DC=5V电源Programmable Temp & Humidity ChamberPower:DC=5V | 20 | 0 | |
| 高温储存试验 High Temperature Storage | High Temp=(85&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 烤箱 Oven | 20 | 0 | |
| 低温储存试验 Low Temperature Storage | Low Temp=(-30&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 环境试验 EnvironmentalTt | 温度循环试验 Temperature Cycle Tt | (85&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (85&plun;5) ℃30min 120min 30 min 100minTt time: 0 cycle 10cycle 50cycle 100cycle | 可程式恒温恒湿试验机 Programmable Temp & Humidity Chamber | 20 | 0 |
| 冷热冲击试验 Thermal Shock Tt | (110&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (110&plun;5) ℃15min 8min 15 min 8minTt time: 0 cycle 10cycle 50cycle 100cycle | 气体式冷热冲击试验机 Thermal Shock Tter (Air to Air) | 20 | 0 | |
| 回流焊试验 Solder Ristance | Temp=260&plun;5℃ Dwell Time=10&plun;1sec; Tt tim=5 tim | 回流焊试验机 Reflow Oven | 20 | 0 | |
| 焊接特性试验 Solder ability | Temp=230&plun;5℃ Dwell Time=5&plun;1sec; | 锡炉 Tin furnace | 20 |
※Precautions for use使用规范
Reflow Profile回流焊规范
Pb-free Solder temperature Profile无铅产品回流焊温度条件曲线规范
te: a)Reflow soldering should t be done more than two tim.
材料焊接次数不过2次。
b)Do t put strs on the LEDs when soldering.
焊接时请不要重压LED灯。
c)Do t warp the circuit board before it he been returned to rmal ambient conditions
after soldering.
焊接后温度未回降到常温时请勿扭曲线路板。
Hand Soldering Profile手工焊接规范
The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad
is to be observed.
手工焊接时，烙铁温度不高于300℃，每个焊脚焊接时间不过3秒
Storage Profile贮存规范
1. Do t open the moisture proof bag before ready to use the LEDs
请在未准备使用LED之前不要打开静电袋子。
2. The LEDs should be kept at 30℃or ls and 60%RH or ls before opening the package.
The max. storage period before opening the package is 1 year.
LED在未开封之前应保存在30℃以下，湿度在60%以下的环境中，长保存期为1年。
3. After opening the package, the LEDs should be kept at 30℃/40%RH or ls, and it should be
used within 7 days
打开包装待后，LED需保存在30℃/40%湿度以下的条件，且须在7天内使用完。
4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking
condition as below: 60&plun;5℃for 12 hours
如果LED出了第3点要求，则LED须经过烘烤才能使用，烘烤条件为：60&plun;5℃，12个
小时
