Laser Vision Measurement品管量测设备
产品特性（FEATUR）
◆使用Window’s视窗介面，中/英文化书面，操作简单。
◆手动量测锡膏厚度
◆手动测量长、宽及两锡膏间之距离（间距）
◆测量值可记录存档及列印
◆提供厚度分布统计图表及X_Bar_R管制表
◆自动计算制程能力指标CP、CPK、
◆可依不同生产线分别作记录
◆可依基板厚度调整焦距
◆可做定时呼叫取样
◆All operations are easy and using Windows interface in Chine/English version.
◆Survey thickns of tin solder by auto matica lly or manually.
◆Survey the length and width manually,and the gap of tin solder.
◆Calculate the measure of area, the measure of cross-seion and the measure of volumn automatically.
◆All surveyed valu can be recorded to a file and be printed to a report.
◆Provide the diagrams of thickns distribution and control diagrams of X_BAR_R.
◆Calculate man faure ability degree automatically(CP, CPK, )
◆It can have proprietary record according to every different produion ling.
◆It can adjust focus point in different thickns of PC boards.
◆It can be called to sample periodically.
适用（APPLECATION）
◆各式厚度量测数值取得统计分析
◆锡膏印刷机制程品管检查
◆锡膏印刷厚度良性测量
◆锡膏印刷成型，尺寸量测检查
◆提供其他物品测厚，测长，量测检查
◆Get the rults of statistics and ysis about all surveyed valu in every thickns degree.
◆Inspe the quality of solder printing procs.
◆Survey the thickns benignancy of tin solder
◆Measure the dimension of tin solder
◆Provide thickns and dimension measurement funion for other objes
功能（FUNION）
◆量测印刷锡膏厚度、长度、高度、间距。
◆提供厚度分布数值参考。
◆提供各种统计分析图表
X管制图、R管制图、厚度列表
X平均值管制图单点列表
◆Surveying the thickns of printing tin solder, length ,height and interval.
◆Provide the referenc of thickns distribution valu.
◆Provide the ysis of different measure of cross-seion.
◆Calculate the measure of area and volumn automatically in obje which to be surveyed.
◆Provide all diagrams of statistics and ysis.
Provide X control Diagram, R Control Diagram
and Thickns List Diagram. Provide X Average
Control Diagram, Single Point List Diagram.
