◎ For surface mounted applications in order to optimize board space
◎ Low profile package
◎ Built-in strain relief
◎ Gl pivated junction
◎ Low inductance
◎ Excellent clamping capability
◎ Repetition Rate (duty cycle):0.01%
◎ Fast rponse time: tically ls than 1.0ps from 0 Volts to V(BR) for unidirectional t
◎ Tical IR ls than 1µA above 10V
◎ High Temperature solderting: 260°C/10 seconds at terminals
◎ Plastic package has Underwriters Laboratory Flammability 94V-O
◎ Pb-free plated
