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IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-minimum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current. I MAX= Maximum fault current device can withstand without damage at rated voltage (V max). Pd=Typical power dissipated from device when in the tripped state in 23°C still air environment. RMIN=Minimum device resistance at 23°C. R1MAX=Maximum device resistance at 23°C, 1 hour after tripping . Physical specifications: Lead material: FRX005~FRX090 Tin plated copper, 24 AWG. FRX110~FRX375 Tin plated copper, 20 AWG. Soldering characteristics: MIL-STD-202, Method 208E. Insulating coating:Flame retardant epoxy, meet UL-94V-0 requirement. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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原装
FSMD010 0.1 0.3 60 10 0.8 8.0 <0.020 1.60 15.00 FSMD014 0.14 0.30 60 10 0.8 8.0 <0.008 1.50 6.50 FSMD020 0.20 0.40 30 10 0.8 8.0 0.02 0.80 5.00 FSMD035 0.35 0.70 16 40 0.8 8.0 0.10 0.32 1.50 FSMD050 0.50 1.00 16 40 0.8 8.0 0.15 0.15 1.00 FSMD075 0.75 1.50 16 40 0.8 8.0 0.02 0.11 0.45 FSMD110 1.10 2.20 6 40 0.8 8.0 0.30 0.04 0.21 FSMD110-16 1.10 1.95 16 40 0.8 8.0 0.50 0.04 0.18 FSMD125 1.25 2.50 6 40 0.8 8.0 0.40 0.05 0.14 FSMD150 1.50 3.00 6 40 0.8 8.0 0.50 0.04 0.11 FSMD160 1.60 3.20 6 40 0.8 8.0 <0.5 0.03 0.10 FSMD200 2.00 3.50 8 40 0.8 8.0 2 0.02 0.07