(Product Description Information) |
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Features |
Ø 8.35*7.7 mm Micro fuse Small volume, Rating Current : MEF 50mA~6.3A ; MET 40mA~10mA ; MSF 50mA~6.3A ; MSt 40mA~10A ; MAF 50mA~10A ; MAT 40mA~10A ; SAF 50mA~6.3A ; SAT 40mA~6.3A Rating Voltage : 250V / 277V / 300Vac Excellent inrush current withstanding capability Excellent withstand capacity for thermal and mechanic shock High reliability and stable solderability. Operating temperature range: -55℃ to +125℃ |
Installation | DIP |
Features Halogen free RoHS compliant for global applications Lead free Ultra-low capacitance (0.05pF typ.) ideal for high speed data applications Provides ESD protection with fast response time (<1ns) allowing equipment to pass IEC 61000-4-2 level 4 test Single-line, bi-directional device for placement flexibility Low profile 0402/1005 design for board space savings Low leakage current (<0.1nA typ.) reduces power consumption (Sn) Tin-plated version available Design Considerations The location in the circuit for the MLP series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal...