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"LCW W5AP dzsc/18/9351/18935190.jpg Features•package:dark SMD package, colorless clear silicone resin, silicone lense; chip level conversion•typical Luminous Flux:203 lm at1400mA (3500 K)•feature of the device:point lightsource with high luminous efficiency and low space•color temperature:2500 K to 4800 K•color reproduction index:80•viewing angle:140°•technology:ThinGaN®•optical efficiency:41 lm/W (3500 K)•grouping parameter:luminous flux, color coordinates•assembly methods:suitable for all SMT assembly methods•soldering methods:IR reflow soldering•preconditioning:acc. to JEDEC Level 2•taping:24 mm tape with 200/reel, ø180 mm•ESD-withstand voltage:up to 2 kV acc. toJESD22-A114-D•Superior Corrosion Robustness:details see page 15 应用范围:Applications 汽车内部和外部照明•exterior and interior automotive lighting (e.g. day time light)手电筒•Flashlight背光源•backlighting (illuminat...
dzsc/18/9362/18936229.jpg Features•package: compact lightsource in multi chip SMT technology with glass window on top•feature of the device: outstanding brightness and luminance due to pure surface emission and low Rth•color coordinates: x = 0.31, y = 0.32 acc. to CIE 1931 (white)•typ. color temperature: 5700 K, 6500 K•viewing angle: Lambertian Emitter (120°)•Radiating surface: 2 x 2 mm²•technology: ThinGaN®•Luminance: 21*106 cd/m²•optical efficiency: 65 lm/W at 350 mA•soldering methods: reflow soldering•ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-D•method of packing: 500 pcs. per reel = packing unit