二合一卡座连接器端子TF+SIM ，2IN1 CARD PUSH，LED，决对工厂
| 价 格： | 1.60 | |
| 品牌/商标： | 国产 | |
| 型号/规格： | 二合一卡座(SIM+TF) | |
| 应用范围： | 手机 | |
| 种类： | 卡座 | |
| 接口类型： | USB | |
| 支持卡数： | 二合一 | |
| 读卡类型： | TF+sim | |
| 形状： | 矩形 | |
| 制作工艺： | 注塑 | |
| 特性： | 阻火/阻燃 | |
| 工作频率： | 高频 | |
| 接触件材质： | C5191 | |
| 绝缘体材质： | LCP | |
| 芯数： | 6+8 | |
| 针数： | 6+8 |
1.Material:
1.1 Housing:HI-Temp plastic UL 94V-0 Rated.
1.2 Contact:Copper Alloy(C5191H t=0.20mm).
2.Specification:
*Electrical Characteristics:
2.1 Current Rating:0.5A.
2.2 Voltage Rating:250V AC/DC
2.3 Dielectric Withstanding Voltage:AC 250V r.m.s.
2.4 Insulation Resistance:1000 M?minimum
at DC 250V.
2.5 Contact Resistance:100 m?maximum.
*Mechanical Performance:
2.6 Micro SD Card extraction force: 1.5N MIN.
2.7 Durability: 10,000 mating cycles.
*Environmental:
2.9 Operating Temperature:-20°~60°
3. Ordering Information:
- 所属城市：广东 深圳
- [联系时请说明来自维库仪器仪表网]
- 联系人： 廖均林
- 电话：0755-29806799
- 传真：0755-29806799
- 手机：
- QQ ：
三合一卡座，SD，MS，R-MMC，钜航版三合一，TF，M2,厂家直销
信息内容：dzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpgdzsc/18/9102/18910290.jpg1.Material:1.1 Housing:HI-Temp plastic UL 94V-0 Rated.1.2 Contact:Copper Alloy(C5191H t=0.20mm).1.3 Grounding:Copper Alloy(C5191H t=0.20mm).1.4 Shell:Stainless Steel(SUS304 t=0.20mm).2.Specification: *Electrical Characteristics:2.1 Current Rating:0.5A.2.2 Voltage Rating:250V AC/DC2.3 Dielectric Withstanding Voltage:AC 500V r.m.s.2.4 Insulation Resistance:1000 M?minimum at DC 500V.2.5 Contact Resistance:100 m?maximum. *Mechanical Performance:2.6 Contact Retention Force:3.0N min./per contact2.7 Mating Force:9.8N Max2.8 Unmating Force:1.47N min and 9.80N max *Environmental:2.9 Operating Temperature:-20°~60°3. Ordering Information:
LED模块/组件/点阵/芯片/支架
信息内容：dzsc/18/9201/18920112.jpgdzsc/18/9201/18920112.jpgdzsc/18/9201/18920112.jpg1.Material:1.1 Housing:PP.1.2 Contact:Copper Alloy1.3 Grounding:Copper Alloy*FINISH:2.1 CONTACTS: GOLD FLASH IN(SEE: P/N) CONTACT AREA. 100U"MIN. TIN PLATING ON SOLDER TAILS. 50u" MIN. NICKEL UNDERPLATED ALL OVER.2.2 Grounding: GOLD FLASH IN(SEE: P/N) CONTACT AREA. 100U"MIN. TIN PLATING ON SOLDER TAILS. 50u" MIN. NICKEL UNDERPLATED ALL OVER.2.3 SHELL: GOLD FLASH ON SOLDER TAILS. 100U"MIN. NICKEL ON AREA .3.Specification: *Electrical Characteristics:3.1 Current Rating:0.5A.3.2 Voltage Rating:250V AC/DC3.3 Dielectric Withstanding Voltage:AC 500V r.m.s.3.4 Insulation Resistance:1000 M?minimum at DC 500V.3.5 Contact Resistance:100 m?maximum. *Mechanical Performance:3.6 Contact Retention Force:3.0N min./per contact3.7 Mating Force:9.8N Max3.8 Unmating Force:1.47N min and 9.80N max *Environmental:3.9 Operating Temperature:-20°~85°4. Ordering Information:
