品牌:RIFF 型号:L008/黄膜/FPC/柔性线路板/软灯条/5050 60D 12V RGB 500*10 机械刚性:柔性 层数:双面 基材:铜 绝缘层厚度:薄型板 加工工艺:压延箔 产品性质:热销 营销方式:厂家直销 营销价格:特价
| 技术参数<Technical Parameters> | ||||
| 项目 | Item | 参数<Parameter> | ||
| 单面<Single Side> | 双面<Double Side> | 多层<Multilayer> | ||
| 板材 | Base Material | XPC/FR1/22F/CEM-1/CEM-3/FR-4/柔性基板,铝基板 | CEM-3/FR-4/柔性基板,铝基板 | FR-4 |
| 板材厚度 | Board Thickness | 0.15MM-3.0MM | 0.15MM-3.0MM | 0.4MM-5.0MM |
| 层数 | Layers | 1 | 2 | 4月8日 |
| 铜箔厚度 | Copper Foil Thickness | 9-70um<标准:18um,35um,70um> | ||
| 抗剥强度 | Peel Strength | 1.25N/mm | 1.25N/mm | 1.25N/mm |
| 绝缘电阻 | Insulation Resistance | ≥10Ω常态 | ||
| 抗电强度 | Electric Strength | ≥1.4KV/mm | ||
| 阻燃特性 | Flame Resisant | 94HB/94VO | 94V-O | 94V-O |
| 最小冲孔孔径 | Min.punch Hole Size | 0.8mm/31mil | ||
| 最小钻孔孔径 | Min.drill Hole Size | 0.3mm/12mil | 0.3mm/12mil | 0.3mm/12mil |
| 孔径公差 | Hole Size Tolerance | ≤Φ0.8mm±0.1mm | ||
| 孔位公差 | Hole location Tolerance | ±0.1mm | ±0.5mm | ±0.5mm |
| 孔壁铜厚 | PTH Wall Thickness | ≥2um/0.8mil | ≥2um/0.8mil | |
| 孔电阻 | Hole Resistance | ≤300u Ω | ≤300u Ω | |
| 最小线宽 | Min.Line Width | 0.3mm/12mil | 0.15mm/6mil | 0.15mm/6mil |
| 最小间距 | Min.Space | 0.3mm/12mil | 0.15mm/6mil | 0.15mm/6mil |
| 表面处理 | Surface Treatment | 松香<Colphony>,喷锡<HAL>,电金<Electroness Au>,抗氧化<OSP>,化金<Chemical Au>,碳油<Carbon Print> | ||
| 翘曲度 | Bow And Twist | ≤1% | ≤1% | ≤1% |
| 最小加工尺寸 | Min.Unit Area | 4mmX6mm | 4mmX6mm | 10mmX10mm |
| 加工尺寸 | Max.Unit Area | 1200mmX500mm | 610mmX510mm | 500mmX450mm |
| 外型尺寸公差 | Profile Tolerance | ±0.15MM<Routing> | ±0.15MM<Routing> | ±0.15MM<Routing> |
| 开槽 | V-CUT | 25℃/30℃/45℃ | ||
| 阻焊硬度 | Soldermask Abrasion | ≥3H | ≥6H | ≥6H |
| 阻焊种类 | Solder Mask Type | 液态感光阻焊油、热固化阻焊油、UV阻焊油,层压PI/PET覆盖膜 | ||
| 阻焊热冲击 | Solderability | 260℃±5℃/10Second/3Time | ||
| 栓验标准 | QC Criterion | GB4588.2 GB4588.4 IPC600E IPC-A-600F IPC-ML-950 | ||
| 客户资料种类 | Pcb Files Type | Protel,Gerber,Powerpcb,Pcad,Autocad,Orcad,Cam350,菲林,样板 | ||
品牌:RIFF 型号:L002/白膜/黑膜/FPC/柔性线路板/软灯条/3528 单色60灯500*8MM12V 机械刚性:柔性 层数:双面 基材:铜 绝缘层厚度:薄型板 加工工艺:压延箔 产品性质:热销 营销方式:厂家直销 营销价格:特价技术参数<Technical Parameters>项目Item参数<Parameter>单面<Single Side>双面<Double Side>多层<Multilayer>板材Base MaterialXPC/FR1/22F/CEM-1/CEM-3/FR-4/柔性基板,铝基板CEM-3/FR-4/柔性基板,铝基板FR-4板材厚度Board Thickness0.15MM-3.0MM0.15MM-3.0MM0.4MM-5.0MM层数Layers 124月8日铜箔厚度Copper Foil Thickness9-70um<标准:18um,35um,70um>抗剥强度Peel Strength1.25N/mm1.25N/mm1.25N/mm绝缘电阻Insulation Resistance≥10Ω常态抗电强度Electric Strength≥1.4KV/mm阻燃特性Flame Resisant94HB/94VO94V-O94V-O最小冲孔孔径Min.punch Hole Size0.8mm/31mil最小钻孔孔径Min.drill Hole Size0.3mm/12mil0.3mm/12mil0.3mm/12mil孔径公差Hole Size Tolerance≤Φ0.8mm±0.1mm孔位公差Hole location Tolerance±0.1mm±0.5mm±0.5mm孔壁铜厚PTH Wall Thickness≥2um/0.8mil≥2um...