品牌:HCY 型号:HCY-FPC1 机械刚性:柔性 层数:多层 基材:镍 绝缘材料:有机树脂 绝缘层厚度:0.35-0.40mm 加工工艺:压延箔 增强材料:玻纤布基 绝缘树脂:聚酰亚胺树脂(PI) 产品性质:热销 营销方式:厂家直销 营销价格:优惠
上图产品银浆柔性线路板,
层数:三层
尺寸:500MM*40MM
板厚:0.38MM
最小孔径:0.5MM
最小线宽线距:0.3MM
用途:重工业
表面工艺:沉金工艺及银浆层
特殊工艺:线路复杂,尺寸面积大,对成形要求特别高
打样:5天,批量7天,最小起订:1PCS
FPC制程能力标准
项目
| 内容 | 常规 | 特殊 |
1 | 层数 NO.OF LAYER | 1~6层 | 8层 |
2 | 完成板尺寸() FINISHED BOARD SIAE (MAX) | 250*650mm | OK |
3 | 完成板尺寸(最小) FINISHED BOARD SIAE (MIN) | 8mm*12mm | OK |
4 | 板厚度() BOARD THICKNESS (MAX) | 23 mil (0.6mm) | OK |
5 | 板厚度(最小) BOARD THICKNESS (MIN) | 3 mil (0.0765mm) | (防焊)0.05mm |
6 | 成品厚度公差(0.085mm≦板厚<0.4mm) FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm) | ±2mil(±0.05m) | OK |
7 | 钻孔孔径() DRILL HOLE DIAMETER (MAX) | 240 mil (6.0mm) | 6.5mm |
8 | 钻孔孔径(最小) DRILL HOLE DIAMETER (MIN) | 8 mil (0.20mm) | 0.15mm |
9 | 外形精度 | ±0.1mm | ±0.05mm |
10 | 完成孔径(最小) For machine drill FINESHED VIA DIAMETER (MIN) | 6 mil (0.15mm) | 0.10mm |
11 | 底铜厚度(最小) OUTER LAYER BASE COPPER THICKNESS (MIN) | 1/2OZ(18um) | 1/3OZ |
12 | 底铜厚度() OUTER LAYER BASE COPPER THICKNESS (MAX) | 2OZ(72um) | 3OZ |
13 | 绝缘层厚度(最小) INNER LAYER DIELECTRIC THICKNESS (MIN) | 0.0127mm(PI厚1/2mil) | OK |
14 | 绝缘层厚度() INNER LAYER DIELECTRIC THICKNESS (MAX) | 0. 50mm(PI厚2mil) | OK |
15 | 材料类型 BASE.MATERIAL | PI聚酰亚胺/PET聚脂 | 无胶基材 |
16 | 孔电镀纵横比() HOLE PLATING ASPECT RATIO (MAX) | 5:1 | OK |
17 | 孔径公差(镀通孔) HOLE DIAMETER TOLERANCE (PTH) | ±3mil(±0.076 mm) | OK |
18 | 钻孔孔径公差(非镀通孔) HOLE DIAMETER TOLERANCG (NPTH) | ±2mil(±0.050mm) | OK |
19 | 孔位公差(与CAD数相比) HOLE POSITION TOLERAMCE (COMPARED WITH CAD DATA) | ±1mil(±0.025mm) | OK |
20 | PTH孔孔壁铜厚 PTH HOLE COPPER THICKNESS | ≧0.5mil(≧12.5um) ≦1.0mil(≦25 um) | ≧8.0um |
品牌:和创亿 型号:FPC 机械刚性:柔性 层数:单面 基材:铜 绝缘材料:有机树脂 绝缘层厚度:薄型板 阻燃特性:V1板 加工工艺:电解箔 增强材料:玻纤布基 绝缘树脂:聚酰亚胺树脂(PI) 产品性质:热销 营销方式:厂家直销 营销价格:优惠生产单面软板,厚板0.18MM可根据客户要求设计,生产,加工贴片一条龙服务质量保证,价格合理 项目 内容常规特殊1层数NO.OF LAYER1~6层8层2完成板尺寸()FINISHED BOARD SIAE (MAX)250*650mmOK3完成板尺寸(最小)FINISHED BOARD SIAE (MIN)8mm*12mmOK4板厚度()BOARD THICKNESS (MAX)23 mil (0.6mm)OK5板厚度(最小)BOARD THICKNESS (MIN)3 mil (0.0765mm)(防焊)0.05mm6成品厚度公差(0.085mm≦板厚<0.4mm)FINESHED BOARD THICKNESS FOLERANCE (0.085MM≦BOARD THICKNESS<0.4mm)±2mil(±0.05m)OK7钻孔孔径()DRILL HOLE DIAMETER (MAX)240 mil (6.0mm)6.5mm8钻孔孔径(最小)DRILL HOLE DIAMETER (MIN)8 mil (0.20mm)0.15mm9外形精度±0.1mm±0.05mm10完成孔径(最小) For machine drillFINESHED VIA DIAMETER (MIN)6 mil (0.15mm)0.10mm11底铜厚度(最小)OUTER LAYER BASE COPPER THICKNESS (MIN)1/2OZ(18um)1/3OZ12底铜厚度...
品牌:HCY 型号:HCYFPC005A0 机械刚性:柔性 层数:双面 基材:铜 绝缘材料:有机树脂 绝缘层厚度:薄型板 阻燃特性:V1板 加工工艺:压延箔 增强材料:玻纤布基 绝缘树脂:聚酰亚胺树脂(PI) 产品性质:军工 营销方式:厂家直销 营销价格:优惠精密军工FPC,两层板材厚:0.15MM +/-0.03MM最小孔径:0.20MM最小线宽:0.1MM最小线距:0.1MM