种类:化合物半导体 特性:耐磨 用途:点银/白胶
| 点胶头 | SP-OD-ID-1300-HS-13 | 0.10/0.13 /0.15/0.16 | 0.25/0.30/ 0.35/0.40 | 0.10/0.15/ 0.05 | 13 | HS-Steel | 新加坡 | |
| 点胶头 | SP-60(30)-1800-HS-13 | 锥度:60或30,直径3.0 | 18 | HS-Steel | 新加坡 | |||
| 点胶针 | MN-孔径-长度-00 | 孔径:12/13/14/15/16/17/18/…/24 | 13 | |||||
| 26-17902(60度) ,L=18 |
| 01-16384 |
| 26-17901(30度) L=18 |
| 88-50001 |
| 88-50001 |
| S26-F38754 |
| 88-50020(S01-67373) SP-25-10-1300-01 0.10/0.25,L=13 |
| 88-50020(0.10/0.254/0.10) 88-50021(0.127/0.30/0.10) 88-50022(0.15/0.356/0.10) 88-50023(0.10/0.30/0.10) 88-50024(0.15/0.35/0.10) 88-50025(0.16/0.40/0.15) 88-50026(0.10/0.35/0.05) 88-50027(0.10/0.50/0.05) |
| ASM-13mm-SEST-F1-F2 NH VR |
| SPT ASM-18mm-SEST-F1-F2 NH VR 其中:F1=0.25,F2=0.1,NH=0.1,VR=0.8 S01-22821, |
| ASM-18mm-SEST-F1-F2 NH VR 其中:F1=1.0,F2=0.2-0.15,NH=0.1,VR=0.8 |