| Specifications | | | |
| | | | |
| Board size
| | | L50 x W30mm to L330 x W250mm
|
| Board thickness
| | | 0.4mm to 3.0mm
|
| Flow direction
| | | Left to right
|
| Placement
speed
| Under optimum conditions
| |
| | | 0.28sec/CHIP
|
| | | | 1608C : 11,100CPH
|
| | | | SOIC16 : 9,300CPH
|
| | | | QFP100 (using TSF1, 2-head consecutive pickup) : 2,700 CPH
|
| Placement
accuracy
| Test setting
| |
| | | Accuracy ( μ+3σ) : +/-0.05mm/CHIP, +/-0.037mm/ to ?20mm,
|
| | | | +/-0.05mm/QFP
|
| | | | Repeatability (3σ) : +/-0.03mm/CHIP, +/-0.03mm/QFP
|
| Z-axis control
| | | 4 heads independent AC servo motor
|
| Component height
| | | 15mm |
| Components applicable
| | | 0603 to 31mm square (NB), SOP/SOJ, QFP, connector,
|
| | | | PLCC, CSP/BGA (NB : The max. component size is restricted by heads.)
|
| Component carriers
| | | 8 to 56mm tape, stick, JEDEC tray (when using TSF1)
|
| Board locating method
| | | Board Clamp Conveyor, Free-thickness PCB backup,
|
| | | | Front reference, Auto conveyor width adjustment (servo control)
|
| Unplaceable area
| | | 3mm from board edge (top and bottom)
|
| Component types
| | | 16 types (8mm tape conversion)
|
| Board transfer height
| | | 900+/-10mm |
| Dimensions and weight
| | | L1,195 x D1,255 x H1,350mm, approx. 750kg
|
| Power and consumption
| | | 1-phase, AC200 to 240V (-10%/+6%), 50/60Hz, 2.8KVA
|
| Air and consumption
| | | Min 0.55MPa, 60L/min A.N.R., clean and dry air
|
| Others | | | Signal tower |
