FEATUR
· Plastic package has underwrit laboratory flammability
Clification 94V-0
· Low profile surface mount package
· Built-in strain relief
· Fast switching for high efficiency
· Gl pivated chip junction
· High temperature soldering
250℃/10 second at terminals
MECHANICAL DATA
· Case: JEDED DO-214AC molded plastic over
gl pivated chip
· Terminals: Solder plated, solderable per MIL-STD-750, method 2026
· Polarity: Color band denot cathode end
· Weight: 0.002ounce, 0.064 gram
